Product Details

Parameter

Layers: 8L

Material: RO4350B

Board Thicknes: 2.0 mm

Copper Thicknes: 35/18/18/35 um

Line/Space: 4/4 mil (inner layer)

Smallest Hole Diameter: 0.15mm

Surface Treatment: ENIG(2U'')

Technical Feature:

Blind/Buride Via Holes, VIPPO; Edge plated

Applications

Communication base station

Special Note:

More Technologies Limited has strong manufacturing capabilities and high-quality products and services. This is a 8-layer high-frequency board with Blind/Buride Via Holes, Epoxy and capping with copper. The regular delivery time is 12 days, and the fastest delivery can be achieved in 7 days.

The high frequency of electronic equipment is a development trend, especially in the development of wireless networks and satellite communications, the high-speed and high-frequency information products, and the standardization of voice, video and data for wireless transmissions with large capacity and fast communication products.

Six Major Points of High Frequency PCB:

1. Low Dielectric constant(2.40) with tight tolerance. PTFE PCB and Ceramic PCB filled composite.

2. Low Dissipation Factor tan(loss tangent),Low Df and Dk allows for low signal distortion and faster signal propogation required by high frequency and high reliability applications.

3. Lower Z-axis CTE,offering supperior PTH reliability.The low Z-CTE and CAF resistance provide long term reliability for both RF and digital applications.

4. High Tg 200 by DMA. Higher heat resistance TD>370, T300>60min. Excellent thickness control for tight tolerance impedance application.

5. Lower moisture absorption with excellent resistance against moisture and heat. 

6. Lead-Free Assembly Compatible,Ideally suited for assemblies with a maximum reflow. temperature of 260 on a conditions of 5-cycle/10 second.

If you have such products or designs, please contact us. More Technologies Limited is happy to provide you with free technical advice and design suggestions.

http://www.rogerspcb.com/